iOS/Android SDK, cloud integration & OTA ready
I²C / SPI / UART with calibration & filtering samples
From prototype to mass production with certification & supply chain
Wafer handling and clean transfer capabilities
Turnkey services for consumer electronics and modules — from design and prototyping to certification and mass production. Bring your idea or prototype!
Bluetooth/BLE, Wi-Fi, sensing and power modules; standardized pinout, reference designs, and rapid integration.
Mobile apps, cloud APIs (MQTT/REST), and OTA pipeline — from samples to mass production.
EMC/wireless (CE/FCC, etc.) test planning, documentation, and mitigation guidance to shorten time-to-cert.
ID/ME design, DFM, BOM and supply-chain onboarding; ramp-up support through pilot to MP.
Component alternatives and risk control; lead-time and cost optimization with second-source planning.
Firmware operations, version management, and product life-cycle (LTS) support with secure updates.
We deliver turnkey, end-to-end services across hardware, firmware, apps, and cloud—from design and prototyping to certification and mass production—for Bluetooth/BLE, Wi-Fi, sensing, and power modules; and we now also offer semiconductor clean wafer-handling solutions (FOUP/FOSB, wafer boats & cassettes, reticle handling, and packaging/test carriers). By combining materials engineering, mechanical design, and automation interoperability, we help customers achieve faster, lower-risk deployment with higher yields.
Standardized pinouts and reference designs to shorten development and verification.
MQTT/REST, WPA3/TLS, delta OTA with rollback — built for reliable deployment.
EMC/wireless test plans, DFM and component alternatives for stable, cost-effective delivery.